Enterprise Server

Enterprise-class servers are mostly used with more than hundreds of networked computers, with strict requirements for data processing speed and data security management, and high requirements for hardware configuration and system reliability. Usually using multiple to dozens of CPU SMP, with independent dual PCI channel and memory expansion board design, high memory bandwidth, high-capacity hot-swappable hard discs and hot-swappable power supplies.

Thermally conductive interface materials and insulating materials that can be applied to enterprise-level servers:

①Thermally conductive silicone grease (BN-GC3096, BN-GC3095, BN-GC3096AP) can be used for NIC chip, GPU, CPU heat dissipation, effectively reducing the interface thermal resistance. Thermally conductive silicone grease is organic silicone as the main raw material, add thermally conductive filler prepared into a paste material, high mobility, good wettability on the surface of the target device, good thermal conductivity, low thermal resistance, applicable to the occasion of greater demand for heat dissipation.

②Thermally conductive spacer (BN-FS series) can be used for server disk array (RAID), SSD memory. Thermally conductive spacer is soft and resilient, with good compression; smooth and flat surface, resistant to friction and puncture; the surface is self-adhesive without the need for additional adhesive.

③Thermal conductive phase change film (BN-PM1040, BN-PM2020) can be used for server CPU cooling, when the CPU surface temperature reaches the phase change temperature, the viscosity decreases from solid to liquid under low pressure, low thermal resistance can be obtained to form a good thermal conductivity interface.

④Heat curing adhesive (BN-RT200H series) can be applied to bond ceramic substrates and heat sinks on server power supplies. It is a one-component additive silicone thermally conductive bonding adhesive with stable performance, rubber elasticity within the range of -40~200℃, flame retardant grade UL94 V-0, in line with environmental protection and halogen-free requirements.

⑤ Thermally conductive gel (BN-TG350, BN-TG350-60) can be used for server disk array (RAID), SSD memory. Thermally conductive gel paste is soft, ultra-low compression stress, no stress damage to components. Good surface wettability, can adapt to irregular target components spot coating.

⑥ BN-FP is used between the housing and the device, it is a black halogen-free flame retardant polycarbonate film with UL94 fire rating up to VTM-0/V-0, with excellent mechanical properties, dimensional stability and high temperature resistance.