Mobile communications infrastructure (5G/4G/3G)

The 5G era brings three important changes: a. Enhanced mobile broadband can be applied to VR/AR technology; b. Large-scale machine class communication enables IoT applications including smart cities and smart homes; c. Ultra-reliable low-latency communication is applied to autonomous driving and industrial control.

5G mobile communication infrastructure is the basic link of 5G network coverage, and the infrastructure used for mobile communication includes base stations, power supply systems, lightning protection and grounding systems, as well as signal source equipment, and power supply systems between remote equipment. At present, 5G communication base station construction has ushered in a critical period of large-scale development.

Compared with 4G, 5G has the requirements of ultra-high speed rate, ultra-low latency, and ultra-wide connection, which needs to be paired with higher performance processors and specialised integrated circuits to enhance the data transmission performance, while the AAU and BBU work with high power consumption and increased heat dissipation. If the internal temperature of the base station is too high, it will affect the normal operation of internal devices, and then cause network instability.

①Thermal Conductive Spacer (BN-FS800) can be used for the heat dissipation of processor and FPGA chips, and its good thermal conductivity and electrical insulation help the heat-generating electronic components to dissipate heat effectively and operate safely. Communication infrastructure is constructed outdoors in varying climatic conditions, and the thermally conductive spacer meets the temperature demand of -60~200℃, which can adapt to the extreme outdoor weather conditions.

②Thermally conductive gel (BN-RT520, BN-TG350-60) can be used for heat transfer between irregular integrated circuits and heat sinks. Power supply system in the power supply power demand, power components increase heat generation, the need for thermally conductive materials to connect the power devices and aluminium shell to increase the efficiency of heat transfer and heat dissipation. Thermally conductive gel gel soft, low compression stress, can adapt to the irregular target components of the spot coating, high thermal conductivity and low thermal resistance, suitable for scenes with high heat dissipation needs.

③ Thermally conductive insulating film (BNG600, BNG410, BNG700, BNK10, BN-TK15) can be used for heat dissipation between power tubes and heat sinks, can be fastened with screws to make the thermally conductive insulating film fully contact with the interface of the heat source and the interface of the heat sink, to improve the efficiency of heat dissipation. Thermally conductive insulating film has high tensile strength, good insulating properties, good flame retardant properties, to meet the environmental requirements of UL.

④ Electronic communication equipment with small space and high integration degree, electromagnetic compatibility problems are highlighted. Thermal conductive absorbing sheet (BN-FS300-TA200, BN-FS300-TA300) combines the dual functions of wave absorption and thermal conductivity, the circuit can be attached to the thermal conductive absorbing sheet to increase the anti-interference, and at the same time, effectively prevent the interference of electromagnetic waves on the surrounding devices.